If YOU have an RF/Microwave question, a circuit
design technique to share, or a question about our software, please ask us
by e-mail. Don't be shy! We'll do our best to either answer directly or
point you in the right direction! If we can't answer,
we're quite sure one of our site visitors will be able to. Let's shareour knowledge and learn new things.
Also, if you have a design
tip that will help other engineers, please e-mail us. We
will post it HERE, along with your name and e-mail address.
Question:
"Bondwire inductance calculation?"
As a young engineer, when I asked this
question of an "old timer," I was told: "Use 20 nanohenrys per inch."
This is what I did until I began to design MIC's (microwave
integrated circuits). I then found the need to be able to calculate
bondwire inductance much more
accurately!
As I later learned, the figure I was given was an approximation for AWG
#18 buss wire. If you look at the sample bondwire calculation in our Utilities+
program, you'll see that the inductance of a 1 mil bond wire, 125 mils
long, 50 mils above ground, operating at 10 GHz is about2.954 nH. The "20 nH/inch" approximation I once used would
have given 2.5 nH, a figure about 29%
lower. A hybrid MIC is quite expensive to prototype. You can easily see
by this that if you're
designing one, and (maybe), it contains dozens of bondwires, you're
"first cut" will likely have to be redone
several times before it performs close to what theory and circuit
design software would predict.
Please see Utilities+ Ad
or our on-line User Manual: manuals/utilpg7.html
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Question: "What is an
L-Match Network?"
It is a two-element impedance matching
network
having an inductor and a capacitor, an "L & a C." One component
is in series and the other in
parallel, hence the
name "L-Match."